Secure registration and collation for ID Cards and Security Document assembly – EID assembly
Today, secure and reliable authorisation for travel, identity and transaction is more important than ever before – achieving the security levels demanded in these areas needs increasingly complex and sophisticated ID cards and secure documentation such as ePassports.
These “EID” products – Electronic Identification Documents – commonly include smart chips with encrypted data and other physical security elements such as buried holograms, antennas and laser personalisation plus tactile surface elements and hinge structures. These help counteract increasingly sophisticated fraud and form the “multiple barriers” that combined create security levels that are very difficult to breach. A consequence of this multiple feature and increased complexity is that the ID card structures and documents are now made from an increasing number of layers and components.
Whereas a Credit card can be made of typically 3-4 layers laminated together and ID card today can have typical 8-12 layers each with a different feature or function. It is this sophistication that has required a different approach to the manufacture of these products and to which Oasys has responded with new manufacturing systems.