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Turnkey solution for contact IC card manufacturing |
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Single operator process |
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Fully integrated and automated for IC chip embedding |
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In-line glue tape application and IC module punching |
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High speed precision cavity milling using HSS cutters with automatic compensation for variations in card thickness |
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Vacuum extraction of waste materials created by the milling process |
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Module embedding using a two stage heat application process |
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Chiller system integrated into the third stage of the embedding process |
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In-line ATR test combined to auto reject facility |
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Simple to operate and quick changeover times via a user-friendly PLC |
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Compact footprint |
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Proven industry track record |
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Robust construction |
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